| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor element to operate normally and stably for a long period of time by efficiently radiating the heat produced by a semiconductor element accommodated in a semiconductor element-accommodating package. SOLUTION: The semiconductor element-accommodating package comprises a roughly rectangular metal substrate 1 having a mount 1a formed on the upper main surface for mounting a semiconductor element 4 and having a screw fixation section 1b provided at the four corners with through holes 1c or notches for screw insertion, a metal frame 2 bonded to the upper main surface of the substrate 1 for enclosing the mount 1a and provided with attachment sections 2a formed on the sides which are through holes or notches for the attachment of input/output terminals 3, ceramic input/output terminals 3 having metallized wiring layers 3a for establishing electrical conduction between the inside and the outside of the frame 2, and a graphite sheet 6 tightly attached to approximately the whole of the lower main surface of the substrate 1. In the graphite sheet 6, the middle section 6b is thicker than any other part. COPYRIGHT: (C)2005,JPO&NCIPI |
