| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting sheet for adhesion composed of a composition containing one-pack type epoxy resin composition, capable of being melted and bonding a material to be bonded without adding specific pressure when cured. SOLUTION: The liquid composition comprises (A) a solid epoxy resin having a film-forming property, (C) a latent curing agent, (D) a monofunctional (meth)acrylate and (E) a photoradical generator and further, as necessary, on or more kinds of materials selected from (B) a liquid epoxy resin, (F) filler, (G) a surfactant, (H) a fine-grained material of crystalline alcohol and (I) a borate. The thermosetting sheet for adhesion is obtained by irradiating a material obtained by applying the liquid composition onto a mold release substrate with UV. COPYRIGHT: (C)2005,JPO&NCIPI
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