发明名称 SUBSTRATE TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an apparatus capable of securely drying a substrate when drying the substrate after the substrate is treated with chemicals and pure water. SOLUTION: The substrate treating apparatus is constituted of having a chemical treating section 10 in which the substrate W is treated by using the chemicals, a pure water and dry treating section 12 in which the substrate W after being treated with the chemicals is treated by using pure water and also the substrate W after being treated with pure water is treated with first drying, a dry treating section 14 in which the substrate W after being treated in the pure water and in dry treating section 12 is treated with secondary drying, and a substrate transfer apparatus 98 with which the substrate W is transferred from the chemical treating section 10 to the pure water and dry treating section 12 and also the substrate W is transferred from the pure water and dry treating section 12 to the dry treating section 14. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004283803(A) 申请公布日期 2004.10.14
申请号 JP20030082257 申请日期 2003.03.25
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 UCHIDA HIROAKI
分类号 B08B3/04;B08B3/08;B65G49/04;H01L21/304;H01L21/677;H01L21/68;(IPC1-7):B08B3/04 主分类号 B08B3/04
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