| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer testing device and its testing method which can surely and easily test semiconductor wafers with very fine connection pad pitches, for a burn-in and others in block in a state of a wafer without causing a continuity failure. SOLUTION: On a face of a probe connection substrate 6 which is opposite to a semiconductor wafer W, bumps 6b are arranged at the same pitch p1 as that of connection pads P on the semiconductor wafer W side so as to be connected with the corresponding connection pads P. On a rear face of the probe connection substrate 6, post electrodes 6d are arranged at a pitch p2 which is larger than the pitch p1 so that they may face corresponding wiring connection pads 8a of a testing wiring board 8 through an anisotropic conductive rubber sheet 7. The corresponding probe electrodes 6b and the corresponding post electrodes 6d are electrically connected by a meandering interconnection 6e via a through hole 6c. COPYRIGHT: (C)2005,JPO&NCIPI
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