| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic component by which unevenness of development can be suppressed. SOLUTION: After a metallic film 11 and a photoresist film 12 are formed on a piezoelectric substrate 10, exposure is performed. Then the photoresist film 12 is partially removed by bringing the piezoelectric substrate 10 into contact with a developing solution on a supporting base 13. In partially removing the photoresist film 12, the piezoelectric substrate 10 is intermittently rotated and rested and, only when the substrate 10 is rotated, the substrate 10 is subjected to vacuum suction. Then the exposed portion of the metallic film 11 and the remainder of the photoresist film 12 are removed. COPYRIGHT: (C)2005,JPO&NCIPI |
