发明名称 |
Modulated temperature method of atomic layer deposition (ALD) of high dielectric constant films |
摘要 |
A method of forming a layer of high-k dielectric material in an integrated circuit includes preparing a silicon substrate; forming a high-k dielectric layer by a sequence of ALD cycles including: depositing a first layer of metal ligand using ALD with an oxygen-containing first precursor; and depositing a second layer of metal ligand using ALD with a second precursor; repeating the sequence of ALD cycles N times until a near-critical thickness of metal oxide is formed; annealing the substrate and metal oxide layers every N ALD cycles in an elevated temperature anneal; repeating the sequence of ALD cycles and elevated temperature anneals until a high-k dielectric layer of desired thickness is formed; annealing the substrate and the metal oxide layers in a final annealing step; and completing the integrated circuit.
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申请公布号 |
US2004203254(A1) |
申请公布日期 |
2004.10.14 |
申请号 |
US20030412550 |
申请日期 |
2003.04.11 |
申请人 |
SHARP LABORATORIES OF AMERICA, INC. |
发明人 |
CONLEY JOHN F.;ONO YOSHI;STECKER GREGORY M. |
分类号 |
C23C16/44;C23C16/455;C23C16/56;H01L21/314;H01L21/316;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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