| 摘要 |
PURPOSE: A flip chip bonding apparatus is provided to obtain high productivity and junction reliability even when a substrate relatively sensitive to a temperature is used by rapidly heating a flip chip and a solder bump while using laser. CONSTITUTION: A carrier substrate(90) is placed on a bonding stage(120). A heating unit(122) for heating the carrier substrate is installed in the bonding stage. The first supersonic oscillation module(124) applies supersonic waves of a predetermined wavelength to the carrier substrate, installed in a side of the outer part of the bonding stage. A flip chip(80) bonded to the carrier substrate is absorbed to a bonding head(140) in which a vacuum path for absorbing the flip chip is formed. The second supersonic oscillation module(144) applies supersonic waves of a predetermined waves to the flip chip, installed in a side of the outer part of the bonding head. A vacuum pressure module(160) supplies vacuum pressure to make the bonding head absorb the flip chip, mounted on the bonding head. The vacuum pressure module delivers the bonding head over the bonding stage according to a progression of a process or vertically moves the bonding head over the bonding stage. A laser supply module(170) applies laser light to the flip chip through an optic fiber(148) interposed between the vacuum paths, installed in a side of the bonding head.
|
