| 摘要 |
PURPOSE: A symmetric type process chamber is provided to execute uniform ashing or etching by improving the asymmetric structure of a process chamber in an ashing process or an etching process of a thin film. CONSTITUTION: A load lock chamber(302) holds a cassette(301) in which a plurality of substrates are loaded. A process chamber(306) forms a thin film on a substrate or removes the thin film from the substrate. A gate valve(305) connects the process chamber with the load chamber. A volume adjustment unit(304) formed at one side of the process chamber adjusts the volume in the process chamber.
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