| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer interconnecting board wherein the difference between the deformation behavior of semiconductor part's chip constitution part and that of a wiring board is relaxed. SOLUTION: A multilayer interconnection board 6 is provided where, with a land 10 formed, a semiconductor part 1 comprising a plurality of electrodes 5 formed in matrix provided with a chip constitution part A, where a semiconductor chip 2 is sealed and a sealing resin constitution part B positioned around the chip constitution part A is mounted. Here, a depletion area 11 formed when a part of layer is removed is formed on the non-mounting surface of a chip projection area C which is a position corresponding to the chip constituting part A.</p> |
