发明名称 NOZZLE ASSEMBLY OF PCB REFLOW SOLDERING SYSTEM CAPABLE OF MAINTAIN UNIFORMLY TEMPERATURE OF PARTS IN PCB
摘要 PURPOSE: A nozzle assembly of a PCB reflow soldering system is provided to maintain uniformly temperature of each part of a PCB by using an absorbing nozzle for absorbing, exhausting, and recycling hot air. CONSTITUTION: A heater is installed at a top side of a center part of a case. A supply fan is installed at a bottom part of the heater and is rotated by a motor. A nozzle assembly(35) is used for receiving hot air from the heater and the supply fan and transmitting the hot air to a PCB through discharge slots(44,45). The hot air is discharged to absorbing parts which are installed at both sides of the spaces formed at each upper part of the discharge slots. An absorbing nozzle(60) is used for exhausting and recycling the hot air of the PCB. The absorbing nozzle is formed with an absorbing nozzle body for blocking the absorbed hot air and an absorbing hole(65) for absorbing the hot air.
申请公布号 KR20040087187(A) 申请公布日期 2004.10.13
申请号 KR20030021457 申请日期 2003.04.04
申请人 ILSUNG MACHINE IND. CO. 发明人 KIM, JAE YEONG
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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