发明名称 Fabrication method for adhesive pressure bonding two components together with closed-loop control
摘要 Two components are bonded together in a bonding apparatus using a bonding medium of malleable metallic spheres and a curable adhesive. The two components are bonded by positioning the components in a facing-but-spaced-apart relation in the bonding apparatus with the spheres and the adhesive between the first component and the second component. The bonding apparatus forces the first component toward the second component with sufficient force to bond the spheres to the first component and to the second component, while monitoring at least one measured bonding reaction of the first component and the second component, and controlling the bonding apparatus responsive to the step of monitoring. The adhesive is thereafter cured, optionally with the bonding pressure released and the assembly removed from the bonding apparatus.
申请公布号 US6802918(B1) 申请公布日期 2004.10.12
申请号 US20010853125 申请日期 2001.05.09
申请人 RAYTHEON COMPANY 发明人 HUGHES GARY B.;MCDONALD JAMES P.;SCHWEIDLER ARTHUR V.;INGLE LLOYD D.
分类号 H01L21/60;H05K3/32;(IPC1-7):B32B31/20 主分类号 H01L21/60
代理机构 代理人
主权项
地址