ELECTROSTATIC CHUCK AND FABRICATING METHOD THEREOF TO SHORTEN GAP BETWEEN FIRST DIELECTRIC AND SECOND DIELECTRIC

摘要

PURPOSE: An electrostatic chuck and a fabricating method thereof are provided to shorten a gap between the first dielectric and the second dielectric by reducing thickness of an electrode. CONSTITUTION: A wafer is loaded on an upper surface of a dielectric(110). An electrode(120) is formed on a bottom of the dielectric. A projection part is formed on a predetermined region of the electrode. The second dielectric(140) is formed on a surface of the electrode. A contact part is electrically connected to the projection part. The contact part penetrates the second dielectric. The thickness of the electrode is 10 to 50 micrometers. The electrode and the projection part are formed with the same material.