COMPACT ELECTRONIC DEVICE HAVING PACKAGE STRUCTURE SUITABLE FOR HERMETICALLY SEALING SURFACE ACOUSTIC WAVE CHIP AND PACKAGE USED THEREFOR

摘要

PURPOSE: A compact electronic device having a package structure suitable for hermetically sealing a surface acoustic wave chip and a package used therefor are provided to stabilize a mounting structure by miniaturizing electronic components in a state of supporting a chip from a backside. CONSTITUTION: A compact electronic device includes a package, a chip, first external terminals, and a plate member. The package has a metal part shaped by pressing a metal member and an insulator part bonded to the metal part through fusing. The chip is housed in the package. The first external terminals(20) are electrically connected to the chip and are buried in the insulator part in order to be arranged in a line. The plate member(15) is used for supporting the chip from a backside thereof. The metal parts have recess parts(19) to define second external terminals. The plate member is provided to cover the recess parts.