POLYMER RESIN FOR UNDERFILL COMPOSITION OF IC ASSEMBLY EXHIBITING SUBSTANTIALLY NO VOLUME CHANGES DURING CURING PROCESS, AND ELECTRONIC DEVICE USING THE SAME TO IMPROVE STRESS CAUSED BY DIFFERENT COEFFICIENT OF TEMPERATURE EXPANSION

摘要

PURPOSE: A polymer resin for an underfill composition of an IC assembly is provided to make substantially no changes in the resulted underfill volume during a curing process, and an electronic device using the same is provided to improve stress caused by different coefficient of temperature expansion (CTE) in IC, carrier and solder joint. CONSTITUTION: The polymer resin for an underfill of an IC assembly, which can be a remoldable polymer resin, comprises at least one dienophile and at least one diene as polymerization units, wherein the diene is possible to undergo Diels-Alder reaction and contains at least one pair of conjugated double bonds having at least one hydrogen on the carbon atoms at the position of 1 or 4. The electronic device comprises an encapsulated IC assembly, which comprises: an integrated circuit(5) which is attached to a carrier board(15) through a multiple of metal joints(10) that form a gap(7) between the carrier board and the circuit; and an underfill material(30) comprised of the polymer resin and a binder selected from polycyclosiloxane.