发明名称 Two mask photoresist exposure pattern for dense and isolated regions
摘要 There is provided a method of making plurality of features in a first layer. A photoresist layer is formed over the first layer. Dense regions in the photoresist layer are exposed through a first mask under a first set of illumination conditions. Isolated regions in the photoresist layer are exposed through a second mask different from the first mask under a second set of illumination conditions different from the first set of illumination conditions. The exposed photoresist layer is patterned and then the first layer is patterned using the patterned photoresist layer as a mask.
申请公布号 US6803178(B1) 申请公布日期 2004.10.12
申请号 US20010887035 申请日期 2001.06.25
申请人 ADVANCED MICRO DEVICES INC 发明人 SUBRAMANIAN RAMKUMAR;BELL SCOTT A;LUKANC TODD P;PLAT MARINA V;OKOROANYANWU UZODINMA;KIM HUNG-ELI
分类号 G03F1/14;G03F7/00;G03F9/00;(IPC1-7):G03F7/00 主分类号 G03F1/14
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