| 摘要 |
A wire bonding method for electrically interconnecting stacked semiconductor chips is disclosed. A substrate (e.g., printed circuit board or metal leadframe) is provided. Metal circuit patterns are provided outside of a chip mounting region of the substrate, and metal transfer patterns are provided proximate to the chip mounting region. Stacked semiconductor are disposed in the chip mounting region. Conductive wires are bonded between respective pads of one stacked chip and respective transfer patterns, and other conductive wires are bonded between respective pads of the other stacked chip and the same respective transfer patterns, thereby electrically connecting respective pads of the two chips through a pair of bond wires and an intermediate transfer pattern. The transfer patterns are separate from circuit patterns of the substrate. At least one of the first and second chips is electrically connected to some of the circuit patterns for external connection.
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