发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device includes a semiconductor substrate; a first insulating film formed on the top surface of the semiconductor substrate; a first gate electrode formed on the first insulating film; a second insulating film having a three-layered structure made by sequentially depositing a first kind of insulating layer, a second kind of insulating layer and a first kind of insulating layer on the first gate electrode; a second gate electrode formed on the second insulating film; a first plane including the side surface of the first gate electrode or the side surface of the second gate electrode; and a second plane including the side surface of the second kind of insulating layer, wherein distance between said first plane and said second plane does not exceed 5 nm.
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申请公布号 |
US6803622(B2) |
申请公布日期 |
2004.10.12 |
申请号 |
US20020274871 |
申请日期 |
2002.10.22 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MATSUNO KOICHI;SHIOZAWA JUNICHI |
分类号 |
H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/72 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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