发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device includes a semiconductor substrate; a first insulating film formed on the top surface of the semiconductor substrate; a first gate electrode formed on the first insulating film; a second insulating film having a three-layered structure made by sequentially depositing a first kind of insulating layer, a second kind of insulating layer and a first kind of insulating layer on the first gate electrode; a second gate electrode formed on the second insulating film; a first plane including the side surface of the first gate electrode or the side surface of the second gate electrode; and a second plane including the side surface of the second kind of insulating layer, wherein distance between said first plane and said second plane does not exceed 5 nm.
申请公布号 US6803622(B2) 申请公布日期 2004.10.12
申请号 US20020274871 申请日期 2002.10.22
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MATSUNO KOICHI;SHIOZAWA JUNICHI
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L29/72 主分类号 H01L21/8247
代理机构 代理人
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