发明名称 Semiconductor memory device for reducing chip size
摘要 A semiconductor memory device that minimizes chip area is provided. The semiconductor memory device includes local input/output (I/O) lines, global I/O lines, and a memory core that is coupled between a bit line and a complementary bit line. The memory core includes a memory cell array, a bit line equalizer circuit, a PMOS sense amplifier (S/A), a PMOS S/A driving circuit for driving the PMOS S/A, a transmission gate circuit, an NMOS S/A, and an NMOS S/A driving circuit for driving the NMOS S/A. First and second transistors for connecting the local I/O lines to the global I/O lines are installed between adjacent bit lines. The PMOS S/A driving circuit, which is a first driving transistor, and the NMOS S/A driving circuit, which is a second driving transistor, are also installed between adjacent bit lines. Because the semiconductor memory device arranges a PMOS S/A driving circuit, an NMOS S/A driving circuit, and a gating circuit for connecting local I/O lines to global I/O lines, between adjacent bit lines, the chip area is reduced.
申请公布号 US6804163(B2) 申请公布日期 2004.10.12
申请号 US20020305986 申请日期 2002.11.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE YUN-SANG;LEE JUNG-BAE
分类号 H01L21/8242;G11C5/02;G11C7/06;G11C7/10;G11C7/12;G11C11/401;H01L27/108;(IPC1-7):G11C8/00 主分类号 H01L21/8242
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