METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING VIBRATOR

摘要

PURPOSE: A method of manufacturing a semiconductor device is provided to peel swiftly off an ultra-thin chip from an adhesive tape by applying longitudinal vibrations using a vibrator while applying tensile force to the adhesive tape in a lateral direction. CONSTITUTION: An adhesive tape(4) is attached on a backside of a semiconductor wafer. The semiconductor wafer is divided into a plurality of semiconductor chips(1) by performing a dicing process. Each semiconductor chip is peeled off from the adhesive tape by applying longitudinal vibrations using a vibrator(110). At this time, tensile force is applied to the adhesive tape in a lateral direction. The frequency of the vibrations is in a range of 1 to 100 kHz and the amplitude of the vibrations is in a range of 1 to 50 μm.