MATERIAL TRANSFER GRIPPER OF LOADING APPARATUS FOR BGA SEMICONDUCTOR PACKAGE TO SMOOTHLY TRANSFER MATERIAL AND PLAN TRANSFER PRECISION

摘要

PURPOSE: A material transfer gripper of a loading apparatus for a BGA(ball grid array) semiconductor package is provided to smoothly transfer a material and plan transfer precision by including a transfer gripper having a gripper transferred in the right-and-left direction in a lead screw according to driving of a motor. CONSTITUTION: A material is transferred by a pair of guide rails A of a predetermined length installed under an inspection part(V) of an inspection system. A lead screw(13) is rotated by the driving of a motor(11), installed under the right center of the guide rail A in parallel with the length direction of the guide rail A. The upper end of a gripper is positioned in the right center of the guide rail A while the gripper is coupled to the lead screw. A guide to which a part of the gripper is coupled stably guides the gripper in the right-and-left direction, installed in the outside of the guide rail A in parallel with the guide rail A.