| 摘要 |
PURPOSE: A semiconductor device for recognizing fingerprint through finger sweeping is provided to perform a fingerprint recognition operation reliably and intend enhancement of reliability by performing finger sweeping. CONSTITUTION: The device includes a semiconductor chip(22A) having a fingerprint recognition sensor part(26) and a substrate(23A) forming an opening part(29) at a position corresponding to the fingerprint recognition sensor part. The semiconductor chip is bonded to the substrate by a flip chip bonding process in order to make the fingerprint recognition area face the opening part. An under-fill material(38) is arranged between the semiconductor chip and the substrate, except the position forming the opening part. |
