| 摘要 |
PURPOSE: A method is provided to achieve improved work efficiency and productivity by simultaneously forming through holes through a UV laser radiation. CONSTITUTION: A method comprises a step(S2,S3) of laminating a dry film on a copper clad laminate and forming a circuit pattern through exposure, development, and etching processes; a step(S4) of bonding a cover lay film onto the copper foil of the copper clad laminate where the circuit pattern is formed; a step(S5) of stacking flexible printed circuit boards with cover layer films bonded thereon, by using a predetermined bonding sheet; a step(S6) of selectively forming through holes or blind via holes by radiating UV laser onto the stacked flexible printed circuit boards; and a step(S7,S8,S9) of plating the through holes or blind via holes, and bonding or depositing a cover lay film or PSR ink onto the outermost copper foil.
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