| 摘要 |
PURPOSE: A method is provided to achieve improved plating property of window open part and conductivity of through holes by treating the window open part with AL-C and processing through holes. CONSTITUTION: A method comprises a step(S5) of stacking printed circuit boards with window open parts into multiple layers by using a bonding sheet, and removing the bonding sheet stacked on the window open part of the inner layer printed circuit board; a step(S6,S7) of pressing the stacked printed circuit boards, and treating the window open part with a drug so as to achieve improved plating property; a step(S8) of forming through holes through the stacked printed circuit boards by using a drill or laser; a step(S9) of forming a plating layer on the through holes and outer layer copper foil, through an electroless copper plating or electrolytic copper plating; and a step(S10) of performing a post-process.
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