发明名称 |
HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF TO REDUCE BREAKDOWN VOLTAGE AND LEAKAGE CURRENT |
摘要 |
PURPOSE: A high voltage device and a method for manufacturing the same are provided to reduce breakdown voltage and leakage current by using a silicon bulk as a source and a drain for high voltage. CONSTITUTION: A trench is formed in a semiconductor substrate(100) having a desired lower structure. A sidewall(102') is formed at inner walls of the trench. A gate electrode is then formed by sequentially forming a gate oxide layer(103) and a gate polysilicon layer in the trench and patterning. A source(105) and a drain(106) are formed at a silicon bulk region located at the sidewalls of the trench.
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申请公布号 |
KR20040085687(A) |
申请公布日期 |
2004.10.08 |
申请号 |
KR20030020476 |
申请日期 |
2003.04.01 |
申请人 |
MAGNACHIP SEMICONDUCTOR, LTD. |
发明人 |
KWAK, CHEOL SANG |
分类号 |
H01L29/78;(IPC1-7):H01L29/78 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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