发明名称 HIGH VOLTAGE DEVICE AND MANUFACTURING METHOD THEREOF TO REDUCE BREAKDOWN VOLTAGE AND LEAKAGE CURRENT
摘要 PURPOSE: A high voltage device and a method for manufacturing the same are provided to reduce breakdown voltage and leakage current by using a silicon bulk as a source and a drain for high voltage. CONSTITUTION: A trench is formed in a semiconductor substrate(100) having a desired lower structure. A sidewall(102') is formed at inner walls of the trench. A gate electrode is then formed by sequentially forming a gate oxide layer(103) and a gate polysilicon layer in the trench and patterning. A source(105) and a drain(106) are formed at a silicon bulk region located at the sidewalls of the trench.
申请公布号 KR20040085687(A) 申请公布日期 2004.10.08
申请号 KR20030020476 申请日期 2003.04.01
申请人 MAGNACHIP SEMICONDUCTOR, LTD. 发明人 KWAK, CHEOL SANG
分类号 H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L29/78
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