SAWING APPARATUS FOR SEMICONDUCTOR PACKAGE PROCESS AND CONTROLLING METHOD THEREOF

摘要

PURPOSE: A sawing apparatus for a semiconductor package process and a controlling method thereof are provided to perform simultaneously a loading process of a strip and an unloading process of a package by using two chuck plates. CONSTITUTION: A chuck table(23) is installed on a chuck table base. The chuck table is horizontally moved on the chuck table base. Two chuck plates(233a,233b) are rotatably installed on an upper part of the chuck table. A strip is alternately loaded on each upper surface of the chuck plates. A cutting unit(30) is moved according to an operation of the chuck table in order to cut the strip loaded on the chuck plates into individual packages. A strip/package picker is used for performing a process for loading the strip on the chuck plates and an unloading process of the packages.