| 摘要 |
PROBLEM TO BE SOLVED: To provide an exposure method to improve production efficiency by purging the substrate surface with inert gas. SOLUTION: In the exposure method to expose a substrate 100 by successively changing the exposure position on the substrate 100 to be exposed via a pattern of a photomask 4 which is not in contact with the substrate, inert gas is jetted to a limited area which includes the exposure position and is smaller than the entire substrate 100. COPYRIGHT: (C)2005,JPO&NCIPI |
