| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling apparatus which can obtain high cooling efficiency and be miniaturized by enabling a cooling object component to be mounted on one side of a substrate without using an expensive metal substrate. SOLUTION: Using a modified U-shaped metal plate 1, both legs 6 thereof are extended from the top of a heat generating body 2 to the side of the body 2 and inserted into the through holes 5 of the substrate 3, then the plate 1 is fixed on the rear side of the substrate 3 at bending portions 6, and the plate 1 presses a heat dissipation member 4 in this state. COPYRIGHT: (C)2005,JPO&NCIPI
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