| 摘要 |
A coating composition for forming a silica-containing film comprises (A) a hydrolyzate and/or partially condensed product of a compound represented by the following general formula (I) and a compound represented by the following general formula (II): wherein R<1 >represents a hydrogen atom, an alkyl group or an aryl group; R<2 >represents an organic group having an unsaturated bond; R<3 >represents an alkyl group; n ranges from 0 to 2; m ranges from 1 to 3, provided that 0<=n+m<=3; and wherein R<4 >represents an alkyl group or an aryl group; R<5 >represents a hydrogen atom; R<6 >represents an alkyl group; and p and q are integers satisfying the relation: 0<=p+q<=3; (B) a solvent for coating; and (C) at least one member selected from the group consisting of a void-forming solvent, a compound having a polyalkylene oxide structure and hollow polymer fine particles. The silica-containing film obtained from the composition is excellent in the heat resistance, adhesive properties and resistance to cracking and has a low dielectric constant. Accordingly, the composition is suitable used as a material for forming an interlayer insulating film in the field of, for instance, semiconductor elements.
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