| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner and its method which can make a wafer surface exposed, in line with the best focusing plane even if the focus depth is reduced, and thereby can achieve a superior resolution; and also to provide a method of manufacturing a device. SOLUTION: The aligner for exposing the pattern of a reticle on a workpiece comprises a detecting means and a control section. The detecting means measures the position of the workpiece at a plurality of first measuring points having a prescribed relative positional relationship in an exposure region of the workpiece where the pattern is to be exposed, and also measures the position of the workpiece at a plurality of second measuring points having the prescribed relative positional relationship outside the exposure region. The controlling section controls at least one out of the position, height, and slope of the workpiece, based on the information on the position of the workpiece measured by the detecting means. COPYRIGHT: (C)2005,JPO&NCIPI |
