发明名称 APPEARANCE INSPECTION DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To solve a problem wherein a void, and a white soldering chip on a white lead are not detected, and a problem wherein a portion of a selection contact trace is imaged black on an image and not discriminated from black foreign matter to bring erroneous detection when the contact trace exists, in a conventional appearance inspection device for a semiconductor. SOLUTION: A CCD camera 5 for image pick-up, and an IC 8 of an image pick-up object in a lower side of a lighting system are arranged in the lighting system of the present invention. The lighting system is constituted of a light guide plate 7 on a semisphere, and has an opening part 6 for the image pick-up in its upper part. An LED comprises the first LED group concentric-circularly provided in a position of an inside by about 40°in the acrylic light guide plate 7, the second LED group for lighting the acrylic light guide plate 7 from its inside, and concentric-circularly provided to illuminate the IC 8 with reflected light thereof, the third LED group for guiding the light to the acrylic light guide plate 7, and concentric-circularly provided to emit the light from the whole acrylic light guide plate 7, and the fourth LED group for irradiating a lead flat part 9a of the IC 8 with the light from a horizontal direction. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004279236(A) 申请公布日期 2004.10.07
申请号 JP20030071659 申请日期 2003.03.17
申请人 NEC SEMICONDUCTORS KYUSHU LTD 发明人 YAAKE TOSHICHIKA
分类号 G01N21/956;(IPC1-7):G01N21/956 主分类号 G01N21/956
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