| 摘要 |
An image sensor includes a substrate, a metal sheet, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has a slot. The metal sheet is attached to the lower surface of the substrate and located under the slot to form a cavity together with the slot. The photosensitive chip is arranged within the cavity and mounted to the metal sheet. The wires electrically connect the photosensitive chip to the substrate. The transparent layer is arranged on the substrate to cover the photosensitive chip. Thus, the photosensitive chip may receive optical signals passing through the transparent layer.
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