| 摘要 |
A method to identify physical mapping of IC products is described. First, a tester is used to exert a stress at a specific address of a chip, so as to generate light, thermal or current variation in an electronic device of the chip. Then, a detecting apparatus is used to detect the chip, for obtaining the actual position of electronic device generating the variation. A photoemission microscope can be used to detect light variation in the chip, a thermal emission microscope can be used to detect thermal variation in the chip, and a superconducting quantum interference device can be used to detect current variation in the chip.
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