| 摘要 |
The invention relates to a method for testing semiconductor devices, to a system including at least one socket or adapter device, and to a socket or adapter device, in particular for semiconductor devices, including at least one connection pin which is designed to be adapted to be connected to a corresponding contact device of a device, wherein the connection pin is designed such that it can be connected to the contact device by surface mounting, in particular by solderless surface mounting.
|
