| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress a damage received by a sensor part even in a severe using environment, and to reduce a wiring resistance. <P>SOLUTION: An aperture 11 is formed by etching on a semiconductor substrate 10, and a membrane 4 is formed on the part. A heater part comprising a polycrystal silicon film 13 is formed on the membrane 4. A diffused resistor region 6 formed by introducing high-concentration impurities into the semiconductor substrate 10 is provided between the polycrystal silicon film 13 and an electrode pad part 5, to thereby electrically connect both parts. Thus, the resistance can be reduced, and a strong constitution against a damage received from the outside can be acquired. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
