| 摘要 |
PROBLEM TO BE SOLVED: To provide an inline sputtering system capable of depositing a thin film of uniform film thickness distribution without increasing the cost when performing film deposition by making a substrate travel in front of a target provided in a film deposition chamber. SOLUTION: In the inline sputtering system, a rail (not shown) provided in a film deposition chamber 3 direction from a front chamber 2 and a carrier 4 has a means to mount and transfer a holder 6 to hold a substrate 5 or a film thickness distribution compensator 7. A means (not shown) to attach and detach the film thickness distribution compensator 7 is provided to the film deposition chamber 3. The size and the cost of the system is suppressed by sharing a transfer means for the substrate 5 and the film thickness distribution compensator 7. Since the film thickness distribution compensator is attached/detached in the film deposition chamber, the uniform film thickness distribution can be realized without degrading the capacity of the system. COPYRIGHT: (C)2005,JPO&NCIPI
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