| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion properties of a molding resin and a passivation film, and to improve the reliability of a semiconductor device. SOLUTION: A passivation film 19 made of a silicon nitride is formed on an insulating film 11. A metal film 22 made of aluminium or an aluminium alloy is formed over the whole surface on the passivation film 19 except a pad 21 and the separation area 23 of the peripheral of the pad. A molding resin 24 is formed on the metal film 22. The metal film 22 has good adhesive properties to both the passivation film 19 and the molding resin 24, and covers substantially the whole surface of the passivation film 19. Consequently, the adhesive properties of the molding resin 24 and the passivation film 19 can be improved. COPYRIGHT: (C)2005,JPO&NCIPI
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