| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal head in which heat of an insulating substrate provided on a circuit board can be transmitted quickly to a thermistor, and detection temperature of the thermistor can be brought closer to the temperature of the insulating substrate. SOLUTION: In the thermal head where the insulating substrate 1a provided with a heating element 2 is secured onto the circuit board 3a and a driving element 4 driving the heating element 2 and the thermistor 5 are provided on the circuit board 3a, a metal pattern 13 for transmitting heat from the lower part of the insulating substrate overlapping the heating element 2 to the thermistor 5 is provided tightly to the circuit board 3a. Since heat of the insulating substrate provided on the circuit board can be transmitted quickly to the thermistor by the heat transmitting metal pattern provided on the circuit board, detection temperature of the thermistor can be brought closer to the temperature of the insulating substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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