SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To miniaturize a semiconductor device including a semiconductor element, and easily manufacture the same.

SOLUTION: The semiconductor device 100 comprises an interposer 18, the semiconductor element 10 formed on the interposer 18 with a central padding 23 formed on an element formation surface, and a bonding wire 20 that electrically connects the central padding 23 and the interposer 8, while the edge of the element forming surface of the semiconductor element 10 through which the bonding wire 20 passes is formed into a taper shape. On the semiconductor element 10 a second semiconductor element 106 equipped with a bonding layer is disposed.

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