| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem wherein the adhesive agent of a dicing sheet is scattered and attached to products to deteriorate their external appearances or cause troubles to their mounting reliability when a plurality of semiconductor devices are collectively sealed up and then subjected to dicing. <P>SOLUTION: The semiconductor device aggregate 2 is irradiated with ultraviolet rays 3 through a mask 1a provided with openings 1b where a blade is made to pass through before a semiconductor device aggregate 2 is subjected to dicing, whereby the adhesive material 6f2a of the dicing sheet 6f located at an area where the blade passes through is hardened to lose its adhesive properties. When the semiconductor device aggregate 2 fixed to the dicing sheet 6f is subjected to dicing, a part of the adhesive material 6f2a of the dicing sheet 6f where the blade is made to pass through is cured already, the adhesive material 6f2a is scattered but restrained from adhering to the semiconductor device aggregate 2, and the scattered adhesive materials are removed by cooling water or the like in a dicing process, so that the products can be prevented from deteriorating their external appearances and from causing troubles to their mounting reliability. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
