发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a high breakdown voltage semiconductor device which is not required to connect to a protective resistor, is hardly subjected to ON-state dielectric breakdown, and hardly deteriorates its electrostatic breakdown characteristics. SOLUTION: A drain region and a source region are provided in a semiconductor substrate, a first gate insulating film is provided on the surface of the semiconductor substrate, and a gate electrode is provided on the first gate insulating film. Furthermore, a second insulating film is provided with a surface lower than the surface of the semiconductor substrate and thicker than the first gate insulating film divides the first gate insulating film into halve, and comes into contact with the first gate insulating film. The second insulating film is provided on the semiconductor substrate and under the gate electrode. An internal resistance region separate from the source region and the drain region is provided right under the second insulating film inside the semiconductor substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004281527(A) 申请公布日期 2004.10.07
申请号 JP20030068126 申请日期 2003.03.13
申请人 TOSHIBA MICROELECTRONICS CORP;TOSHIBA CORP 发明人 TAKADA OSAMU
分类号 H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L29/78
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