| 摘要 |
PROBLEM TO BE SOLVED: To obtain a one package type epoxy resin composition having good preservation stability and good curability at the preservation temperature+20°C, and to provide a one package type epoxy resin adhesive using the one package type epoxy resin composition. SOLUTION: The one package type resin composition is obtained by compounding (A) an epoxy resin, (B) a latent curing agent and (C) a finely divided substance of a crystalline alcohol. The one package type epoxy resin composition comprises further (D) a boric acid ester and(or) (E) a filler in the composition. The adhesive uses the one package type epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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