Method and apparatus for laser ablative modification of dielectric surfaces

摘要

The present invention provides a method and apparatus (100) for laser (101) ablative modification of surfaces (120). The apparatus (100) includes a controller adapted to determine the wavelength corresponding to a characteristic wavelength of the absorption band, as well as an intensity and a duration such that a light pulse with the determined wavelength, intensity, and duration is capable of heating the portion of the dielectric material (120) to approximately the critical temperature of the dielectric material on a time scale less than about the characteristic time scale for thermal diffusion in the dielectric material and thereby inducing a phase explosion in the dielectric material. The apparatus further includes a laser (101) capable of providing at least one light pulse with the determined wavelength, intensity and duration in response to a signal from the controller.