| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stable and highly precise semiconductor device by preventing a loop from hanging down by suppressing the height of the wire loop low. <P>SOLUTION: In connecting a gold bump 4 formed on a semiconductor chip 3 to a gold bump 6 formed on an inner lead 5 by a gold wire 7, a second bending point B and a third bending point C are formed on the gold wire 7. The gold wire 7 is formed so that a distance between the gold bump B formed on the inner lead 5 and the second bending point B and a distance between the gold bump 6 and the third bending point C are 0.15×L and 0.4×L, respectively, where a horizontal distance of these bumps is L, and so that the heights of the gold bump 4 and the third bending point C are the highest point of the gold wire 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
