| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive having high reliability in which heat injury of chip by heat in assembling is suppressed by lowering of an attaching temperature. <P>SOLUTION: In the polyimide resin, a main acid component is composed of 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride and 4,4'-oxydiphthalic acid dianhydride and a main amine component is composed of one kind of diamine selected from either one of 2,2-bis(4-(4-aminophenoxy)phenyl)propane and 1,3-bis(3-aminophenoxy)benzene, and diaminosiloxane compound represented by general formula (1). The polyimide resin is soluble in an organic solvent and has 100-150°C glass transition temperature. The polyimide resin is used for adhesive members used for bonding semiconductor chips to lead frames in an assembling process of semiconductor package. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
