| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package substrate that can cope with high integration of a semiconductor. <P>SOLUTION: Each semiconductor package is produced through the steps of removing an insulated substrate at a place where an external connection terminal for writing is formed, arranging a through-hole for the external connection terminal, form multiple sets of wirings on one side of the insulated substrate, mounting a semiconductor device via a die bonding tape on the insulated substrate where the multiple sets of wirings are formed, electrically connecting the semiconductor device terminal and the wirings, sealing the semiconductor device with resin, forming the external connection terminal in the through-hole for the external connection terminal that has electrical conduction with the wirings, and separating it into the individual semiconductor packages. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
