| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make thin a circuit board assembly including a bus bar circuit board. <P>SOLUTION: A circuit board 1 for wiring a wire 12 is provided with level difference parts 3 and 4 continuously to a plate part 9 thinner than the wiring circuit board, and bus bar circuit boards 5 and 6 are arranged at the plate part 9. The level difference parts 3 and 4 are provided on the surface and rear of the wiring circuit board 1, the plate part 9 is located in the center of the wiring circuit board in the thickness direction, and the bus bar circuit boards 5 and 6 are arranged on the surface and rear of the plate part. The bus bar circuit boards 5 and 6 have a thickness equal to or smaller than the thickness of the level difference parts 3 and 4. A bus bar 21 is contained in the wiring groove 22 of the bus bar circuit boards 5 and 6. Terminal 25 of the bus bar 21 on the bus bar circuit board 5 is connected with the wire 12 on the wiring circuit board 1. The first bus bar circuit board 5 engages with one level difference part 3 of the first layer wiring circuit board 1 and the second bus bar circuit board 6 secured to a second layer wiring circuit board 2 engages with the other level difference part 4 of the wiring circuit board 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
