| 摘要 |
PROBLEM TO BE SOLVED: To dissipate the heat in a separated location by including the material whose thermal conductivity is high on a substrate when a heating element or an element necessary for cooling is mounted on the substrate. SOLUTION: In a heating element heat dissipation structure, a case is arranged on the substrate to surround the heating element, a lid is attached from the upper part of the case so as to cover the heating element, and the heating element is connected to a pattern for heat dissipation. In the structure, the pattern is extended from a part covered with the case and the lid to a part on the outer substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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