发明名称 FILM DEPOSITING DEVICE AND FILM DEPOSITING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film depositing device which is capable of improving a film material in consumption efficiency. SOLUTION: The film depositing device 1 is equipped with a transfer chamber 11 and a film depositing chamber 30. A substrate 5 loaded into the film depositing chamber 30 by a transfer robot 15 is delivered to a substrate replacing site 38 and then sent to a film depositing site 39 by a transfer mechanism 31, and a film is grown on the surface of the substrate 5 while the substrate 5 passes through the film depositing site 39. When the substrate 5 passes through the film depositing site 39, the other substrate 5 is delivered to the substrate replacing site 38 and sent to the film depositing side 39, so that the substrates 5 pass successively through the film depositing site 39. Therefore, a film depositing operation is carried out as film material vapor is discharged out at a film depositing site 39, the film material vapor is not wasted, and the film material can be kept high in consumption efficiency. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004281523(A) 申请公布日期 2004.10.07
申请号 JP20030068101 申请日期 2003.03.13
申请人 ULVAC JAPAN LTD 发明人 ODAGI HIDEYUKI
分类号 C23C14/50;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 C23C14/50
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