| 摘要 |
PROBLEM TO BE SOLVED: To efficiently detect via defects and contact defects, and thereby easily presuming causes of defects. SOLUTION: A test circuit 20 is provided on a circuit for transmitting a test signal inputted from a test signal input section 12 to a test signal output section 14. Also, the test circuit 20 includes a plurality of vias and contacts to be tested denoted by a symbol 3 and a plurality of wiring patterns, denoted by a symbol 5, formed by sequentially electrically connecting the vias and the contacts in series. Problems of defects of a via, a contact and a wiring pattern in production can be grasped from a signal outputted from the section 14 to the outside of a semiconductor integrated circuit. COPYRIGHT: (C)2005,JPO&NCIPI
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