| 摘要 |
PROBLEM TO BE SOLVED: To surely obtain a desired circuit pattern and, in addition, to reduce the transmission loss of high-frequency electric signals while the manufacturing process of a three-dimensional circuit board is simplified and the manufacturing cost of the circuit board is reduced. SOLUTION: A dielectric substrate 1 having grooves 5 along both sides of a prescribed surface portion 1a on its main surface 1A is formed by injection molding a synthetic resin material by using metal molds, and a resin mask 2 composed of a hydrolytic macromolecular material is formed to expose the prescribed surface portion 1a and side walls 5a and bottom edges 5b of the grooves 5 formed continuously from the portion 1a and to cover the other surface of the substrate 1. Successively, the resin mask 2 is coated with a conductive layer 3 and the resin mask 2 is removed together with the conductive film 3 coating the surface of the mask 2. Consequently, the manufacturing process of a three-dimensional circuit board can be simplified and the manufacturing cost of the board can be reduced, because the formation of the wiring 3a and the removal of the mask 2 can be performed in the same step. In addition, the transmission loss of the high-frequency electric signals caused by the interference of electric fields can be reduced, because two adjacent wiring 3a are certainly insulated from each other by the grooves 5 at the time of transmitting the signals. COPYRIGHT: (C)2005,JPO&NCIPI
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